IS43R86400D-6BL

SKU: 30447

Manufacturer: Integrated Silicon Solution Inc

DRAM Chip DDR SDRAM 512Mbit 64Mx8 2.5V 60-Pin TFBGA

2270 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	NRND
Automotive	No
PPAP	No
DRAM Type	DDR SDRAM
Chip Density (bit)	512M
Organization	64Mx8
Number of Internal Banks	4
Number of Words per Bank	16M
Number of Bits/Word (bit)	8
Data Bus Width (bit)	8
Maximum Clock Rate (MHz)	166
Maximum Access Time (ns)	0.7
Address Bus Width (bit)	15
Process Technology	CMOS
Interface Type	SSTL_2
Operating Supply Voltage-Min (V)	2.3
Typical Operating Supply Voltage (V)	2.5
Operating Supply Voltage-Max (V)	2.7
Operating Current (mA)	370
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	8
Original Package	TFBGA
Pin Count	60
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.8(Max)
Package Length	13
Package Width	8
PCB changed	60

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	NRND
Automotive	No
PPAP	No
DRAM Type	DDR SDRAM
Chip Density (bit)	512M
Organization	64Mx8
Number of Internal Banks	4
Number of Words per Bank	16M
Number of Bits/Word (bit)	8
Data Bus Width (bit)	8
Maximum Clock Rate (MHz)	166
Maximum Access Time (ns)	0.7
Address Bus Width (bit)	15
Process Technology	CMOS
Interface Type	SSTL_2
Operating Supply Voltage-Min (V)	2.3
Typical Operating Supply Voltage (V)	2.5
Operating Supply Voltage-Max (V)	2.7
Operating Current (mA)	370
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	8
Original Package	TFBGA
Pin Count	60
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.8(Max)
Package Length	13
Package Width	8
PCB changed	60