IS43LR32160C-6BL

SKU: 72852

Manufacturer: Integrated Silicon Solution Inc

DRAM Chip Mobile-DDR SDRAM 512Mbit 16Mx32 1.8V 90-Pin TFBGA

1170 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.28
Automotive	No
PPAP	No
DRAM Type	Mobile-DDR SDRAM
Chip Density (bit)	512M
Organization	16Mx32
Number of Internal Banks	4
Number of Words per Bank	4M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	166
Maximum Access Time (ns)	5.5
Address Bus Width (bit)	15
Interface Type	LVCMOS
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	130
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	32
Original Package	TFBGA
Pin Count	90
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.8(Max)
Package Length	13
Package Width	8
PCB changed	90

Your name

Your email

Enquiry

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.28
Automotive	No
PPAP	No
DRAM Type	Mobile-DDR SDRAM
Chip Density (bit)	512M
Organization	16Mx32
Number of Internal Banks	4
Number of Words per Bank	4M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	166
Maximum Access Time (ns)	5.5
Address Bus Width (bit)	15
Interface Type	LVCMOS
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	130
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	32
Original Package	TFBGA
Pin Count	90
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.8(Max)
Package Length	13
Package Width	8
PCB changed	90