IS42RM16160D-7BLI

SKU: 51818

Manufacturer: Integrated Silicon Solution Inc

DRAM Chip Mobile SDRAM 256Mbit 16Mx16 2.5V 54-Pin TFBGA

3650 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.24
Automotive	No
PPAP	No
DRAM Type	Mobile SDRAM
Chip Density (bit)	256M
Organization	16Mx16
Number of Internal Banks	4
Number of Words per Bank	4M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	143
Maximum Access Time (ns)	5.4
Address Bus Width (bit)	15
Operating Supply Voltage-Min (V)	2.3
Typical Operating Supply Voltage (V)	2.5
Operating Supply Voltage-Max (V)	2.7
Operating Current (mA)	110
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Number of I/O Lines (bit)	16
Original Package	TFBGA
Pin Count	54
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.8(Max)
Package Length	13
Package Width	8
PCB changed	54

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.24
Automotive	No
PPAP	No
DRAM Type	Mobile SDRAM
Chip Density (bit)	256M
Organization	16Mx16
Number of Internal Banks	4
Number of Words per Bank	4M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	143
Maximum Access Time (ns)	5.4
Address Bus Width (bit)	15
Operating Supply Voltage-Min (V)	2.3
Typical Operating Supply Voltage (V)	2.5
Operating Supply Voltage-Max (V)	2.7
Operating Current (mA)	110
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Number of I/O Lines (bit)	16
Original Package	TFBGA
Pin Count	54
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.8(Max)
Package Length	13
Package Width	8
PCB changed	54