HYB25D256160CF-5

SKU: 115265

Manufacturer: Infineon Technologies AG

DRAM Chip DDR SDRAM 256Mbit 16Mx16 2.6V 60-Pin TFBGA

160 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.24
Automotive	Unknown
DRAM Type	DDR SDRAM
Chip Density (bit)	256M
Organization	16Mx16
Number of Internal Banks	4
Number of Words per Bank	4M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	400
Maximum Access Time (ns)	0.5
Address Bus Width (bit)	15
Interface Type	SSTL_2
Operating Supply Voltage-Min (V)	2.5
Typical Operating Supply Voltage (V)	2.6
Operating Supply Voltage-Max (V)	2.7
Operating Current (mA)	250
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	16
Original Package	TFBGA
Pin Count	60
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Length	12
Package Width	8
PCB changed	60

Your name

Your email

Enquiry

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.24
Automotive	Unknown
DRAM Type	DDR SDRAM
Chip Density (bit)	256M
Organization	16Mx16
Number of Internal Banks	4
Number of Words per Bank	4M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	400
Maximum Access Time (ns)	0.5
Address Bus Width (bit)	15
Interface Type	SSTL_2
Operating Supply Voltage-Min (V)	2.5
Typical Operating Supply Voltage (V)	2.6
Operating Supply Voltage-Max (V)	2.7
Operating Current (mA)	250
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	16
Original Package	TFBGA
Pin Count	60
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Length	12
Package Width	8
PCB changed	60