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    BSC117N08NS5

    SKU: 138464
    Manufacturer: Infineon Technologies AG
    Trans MOSFET N-CH 80V 49A Automotive 8-Pin TDSON EP T/R
    8290 parts IN STOCK
    Shipped from :
    Netherlands
    Expected Ships :
    Rohs State : Need to verify

    QUANTITY

    Increments of 0 pcs
    Products specifications
    EU RoHS Compliant with Exemption
    ECCN (US) EAR99
    Part Status Active
    SVHC Yes
    SVHC Exceeds Threshold Yes
    Automotive Unknown
    PPAP Unknown
    Product Category Power MOSFET
    Configuration Single Quad Drain Triple Source
    Process Technology OptiMOS 5
    Channel Mode Enhancement
    Channel Type N
    Number of Elements per pcs 1
    Maximum Drain Source Voltage (V) 80
    Maximum Gate Source Voltage (V) 20
    Maximum Gate Threshold Voltage (V) 3.8
    Operating Junction Temperature (°C) -55 to 150
    Maximum Continuous Drain Current (A) 49
    Maximum Gate Source Leakage Current (nA) 100
    Maximum IDSS (uA) 1
    Maximum Drain Source Resistance (mOhm) 11.7@10V
    Typical Gate Charge @ Vgs (nC) 15@10V
    Typical Gate Charge @ 10V (nC) 15
    Typical Gate to Drain Charge (nC) 3
    Typical Gate to Source Charge (nC) 5
    Typical Reverse Recovery Charge (nC) 45
    Typical Switch Charge (nC) 6
    Typical Input Capacitance @ Vds (pF) 1000@40V
    Typical Reverse Transfer Capacitance @ Vds (pF) 11@40V
    Minimum Gate Threshold Voltage (V) 2.2
    Typical Output Capacitance (pF) 180
    Maximum Power Dissipation (mW) 2500
    Typical Fall Time (ns) 3
    Typical Rise Time (ns) 4
    Typical Turn-Off Delay Time (ns) 16
    Typical Turn-On Delay Time (ns) 10
    Operating Temperature-Min -55
    Operating Temperature-Max 150
    Supplier Temperature Grade Automotive
    Packing Method Tape and Reel
    Maximum Power Dissipation on PCB @ TC=25°C (W) 2.5
    Maximum Pulsed Drain Current @ TC=25°C (A) 196
    Maximum Junction Ambient Thermal Resistance on PCB (°C/W) 50
    Typical Diode Forward Voltage (V) 0.9
    Typical Gate Plateau Voltage (V) 5
    Typical Reverse Recovery Time (ns) 37
    Maximum Diode Forward Voltage (V) 1.1
    Typical Gate Threshold Voltage (V) 3
    Maximum Gate Resistance (Ohm) 1.7
    Maximum Positive Gate Source Voltage (V) 20
    Maximum Continuous Drain Current on PCB @ TC=25°C (A) 19
    Pin Count 8
    Standard Package Method SON
    Original Package TDSON EP
    Terminal Form Surface Mount
    Package Height 1
    Package Length 5.15
    Package Width 5.9
    PCB changed 8
    Products specifications
    EU RoHS Compliant with Exemption
    ECCN (US) EAR99
    Part Status Active
    SVHC Yes
    SVHC Exceeds Threshold Yes
    Automotive Unknown
    PPAP Unknown
    Product Category Power MOSFET
    Configuration Single Quad Drain Triple Source
    Process Technology OptiMOS 5
    Channel Mode Enhancement
    Channel Type N
    Number of Elements per pcs 1
    Maximum Drain Source Voltage (V) 80
    Maximum Gate Source Voltage (V) 20
    Maximum Gate Threshold Voltage (V) 3.8
    Operating Junction Temperature (°C) -55 to 150
    Maximum Continuous Drain Current (A) 49
    Maximum Gate Source Leakage Current (nA) 100
    Maximum IDSS (uA) 1
    Maximum Drain Source Resistance (mOhm) 11.7@10V
    Typical Gate Charge @ Vgs (nC) 15@10V
    Typical Gate Charge @ 10V (nC) 15
    Typical Gate to Drain Charge (nC) 3
    Typical Gate to Source Charge (nC) 5
    Typical Reverse Recovery Charge (nC) 45
    Typical Switch Charge (nC) 6
    Typical Input Capacitance @ Vds (pF) 1000@40V
    Typical Reverse Transfer Capacitance @ Vds (pF) 11@40V
    Minimum Gate Threshold Voltage (V) 2.2
    Typical Output Capacitance (pF) 180
    Maximum Power Dissipation (mW) 2500
    Typical Fall Time (ns) 3
    Typical Rise Time (ns) 4
    Typical Turn-Off Delay Time (ns) 16
    Typical Turn-On Delay Time (ns) 10
    Operating Temperature-Min -55
    Operating Temperature-Max 150
    Supplier Temperature Grade Automotive
    Packing Method Tape and Reel
    Maximum Power Dissipation on PCB @ TC=25°C (W) 2.5
    Maximum Pulsed Drain Current @ TC=25°C (A) 196
    Maximum Junction Ambient Thermal Resistance on PCB (°C/W) 50
    Typical Diode Forward Voltage (V) 0.9
    Typical Gate Plateau Voltage (V) 5
    Typical Reverse Recovery Time (ns) 37
    Maximum Diode Forward Voltage (V) 1.1
    Typical Gate Threshold Voltage (V) 3
    Maximum Gate Resistance (Ohm) 1.7
    Maximum Positive Gate Source Voltage (V) 20
    Maximum Continuous Drain Current on PCB @ TC=25°C (A) 19
    Pin Count 8
    Standard Package Method SON
    Original Package TDSON EP
    Terminal Form Surface Mount
    Package Height 1
    Package Length 5.15
    Package Width 5.9
    PCB changed 8