EU RoHS
|
Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
Active |
HTS
|
8542.39.00.01 |
Automotive
|
No |
PPAP
|
No |
Logic Family
|
AUP |
Logic Function
|
NAND |
Number of Elements per pcs
|
1 |
Number of Element Inputs
|
2-IN |
Number of Output Enables per Element
|
0 |
Number of Selection Inputs per Element
|
0 |
Number of Element Outputs
|
1 |
Maximum Propagation Delay Time @ Maximum CL (ns)
|
22@1.1V to 1.3V |
Absolute Propagation Delay Time (ns)
|
24.9 |
Process Technology
|
CMOS |
Maximum Low Level Output Current (mA)
|
4 |
Maximum High Level Output Current (mA)
|
-4 |
Operating Supply Voltage-Min (V)
|
0.8 |
Typical Operating Supply Voltage (V)
|
1.8 |
Operating Supply Voltage-Max (V)
|
3.6 |
Maximum Quiescent Current (uA)
|
0.5 |
Propagation Delay Test Condition (pF)
|
30 |
Operating Temperature-Min
|
-40 |
Operating Temperature-Max
|
125 |
Packing Method
|
Tape and Reel |
Standard Package Method
|
DFN |
Original Package
|
X2-DFN |
Pin Count
|
6 |
Terminal Form
|
Surface Mount |
Package Height
|
0.37 |
Package Length
|
1 |
Package Width
|
1 |
PCB changed
|
6 |