S29GL032N90BFI030

SKU: 63771

Manufacturer: Cypress - An Infineon Technologies Company

NOR Flash Parallel 3V/3.3V 32M-bit 4M x 8/2M x 16 90ns 48-Pin FBGA Tray

190 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991.b.1.a
Part Status	LTB
HTS	8542.32.00.71
Automotive	No
PPAP	No
Cell Type	NOR
Chip Density (bit)	32M
Architecture	Sectored
Boot Block	Yes
Block Organization	Asymmetrical
Location of Boot Block	Top
Address Bus Width (bit)	22/21
Sector Size	64Kbyte x 63
Page Size	8Words/16byte
Number of Bits/Word (bit)	8/16
Number of Words	4M/2M
Programmability	Yes
Timing Type	Asynchronous
Max. Access Time (ns)	90
Maximum Erase Time (s)	64/Chip
Maximum Page Access Time (ns)	25
Maximum Programming Time (ms)	31500(Typ)/Chip
OE Access Time (ns)	25
Process Technology	110nm, MirrorBit
Interface Type	Parallel
Operating Supply Voltage-Min (V)	2.7
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.6
Programming Voltage (V)	2.7 to 3.6
Operating Current (mA)	50
Page Read Current (mA)	20
Program Current (mA)	60
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Command Compatible	Yes
ECC Support	No
Support of Page Mode	Yes
Minimum Endurance (Cycles)	100000
Packing Method	Tray
Original Package	FBGA
Pin Count	48
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.76(Max)
Package Length	8.15
Package Width	6.15
PCB changed	48

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Products specifications

EU RoHS	Compliant
ECCN (US)	3A991.b.1.a
Part Status	LTB
HTS	8542.32.00.71
Automotive	No
PPAP	No
Cell Type	NOR
Chip Density (bit)	32M
Architecture	Sectored
Boot Block	Yes
Block Organization	Asymmetrical
Location of Boot Block	Top
Address Bus Width (bit)	22/21
Sector Size	64Kbyte x 63
Page Size	8Words/16byte
Number of Bits/Word (bit)	8/16
Number of Words	4M/2M
Programmability	Yes
Timing Type	Asynchronous
Max. Access Time (ns)	90
Maximum Erase Time (s)	64/Chip
Maximum Page Access Time (ns)	25
Maximum Programming Time (ms)	31500(Typ)/Chip
OE Access Time (ns)	25
Process Technology	110nm, MirrorBit
Interface Type	Parallel
Operating Supply Voltage-Min (V)	2.7
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.6
Programming Voltage (V)	2.7 to 3.6
Operating Current (mA)	50
Page Read Current (mA)	20
Program Current (mA)	60
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Command Compatible	Yes
ECC Support	No
Support of Page Mode	Yes
Minimum Endurance (Cycles)	100000
Packing Method	Tray
Original Package	FBGA
Pin Count	48
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.76(Max)
Package Length	8.15
Package Width	6.15
PCB changed	48