CYD18S72V18-200BGXI

SKU: 30258

Manufacturer: Cypress - An Infineon Technologies Company

SRAM Chip Sync Dual 1.8V 18M-bit 256K x 72-bit 9ns/5ns 484-Pin BGA Tray

350 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991.b.2.a
Part Status	Obsolete
HTS	8542.32.00.41
Automotive	No
PPAP	No
Chip Density (bit)	18M
Number of Words	256K
Number of Bits/Word (bit)	72
Architecture	Flow-Through
Data Rate Architecture	SDR
Address Bus Width (bit)	18
Number of Ports	2
Timing Type	Synchronous
Max. Access Time (ns)	9@Flow-Through
Maximum Clock Rate (MHz)	77@Flow-Through
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	1030
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Packing Method	Tray
Original Package	BGA
Pin Count	484
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1.53
Package Length	23
Package Width	23
PCB changed	484

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Products specifications

EU RoHS	Compliant
ECCN (US)	3A991.b.2.a
Part Status	Obsolete
HTS	8542.32.00.41
Automotive	No
PPAP	No
Chip Density (bit)	18M
Number of Words	256K
Number of Bits/Word (bit)	72
Architecture	Flow-Through
Data Rate Architecture	SDR
Address Bus Width (bit)	18
Number of Ports	2
Timing Type	Synchronous
Max. Access Time (ns)	9@Flow-Through
Maximum Clock Rate (MHz)	77@Flow-Through
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	1030
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Packing Method	Tray
Original Package	BGA
Pin Count	484
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1.53
Package Length	23
Package Width	23
PCB changed	484