CYD18S72V-100BBC

SKU: 110376

Manufacturer: Cypress - An Infineon Technologies Company

SRAM Chip Sync Dual 3.3V 18M-bit 256K x 72-bit 5.2ns 484-Pin FBGA Tray

420 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Not Compliant
ECCN (US)	3A991.b.2.a
Part Status	Obsolete
HTS	8542.32.00.71
Automotive	No
PPAP	No
Chip Density (bit)	18M
Number of Words	256K
Number of Bits/Word (bit)	72
Architecture	Pipelined
Data Rate Architecture	SDR
Address Bus Width (bit)	36
Number of Ports	2
Timing Type	Synchronous
Max. Access Time (ns)	5.2
Maximum Clock Rate (MHz)	100
Operating Supply Voltage-Min (V)	3.135
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.465
Operating Current (mA)	450
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Packing Method	Tray
Original Package	FBGA
Pin Count	484
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1.26
Package Length	23
Package Width	23
PCB changed	484

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Products specifications

EU RoHS	Not Compliant
ECCN (US)	3A991.b.2.a
Part Status	Obsolete
HTS	8542.32.00.71
Automotive	No
PPAP	No
Chip Density (bit)	18M
Number of Words	256K
Number of Bits/Word (bit)	72
Architecture	Pipelined
Data Rate Architecture	SDR
Address Bus Width (bit)	36
Number of Ports	2
Timing Type	Synchronous
Max. Access Time (ns)	5.2
Maximum Clock Rate (MHz)	100
Operating Supply Voltage-Min (V)	3.135
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.465
Operating Current (mA)	450
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Packing Method	Tray
Original Package	FBGA
Pin Count	484
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1.26
Package Length	23
Package Width	23
PCB changed	484