CYD18S18V18-200BBAXC

SKU: 30257

Manufacturer: Cypress - An Infineon Technologies Company

SRAM Chip Sync Dual 1.8V 18M-bit 1M x 18 9ns/5ns 256-Pin FBGA Tray

230 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991.B.2.B
Part Status	Obsolete
Automotive	No
PPAP	No
Chip Density (bit)	18M
Number of Words	1M
Number of Bits/Word (bit)	18
Architecture	Flow-Through
Data Rate Architecture	SDR
Address Bus Width (bit)	20
Number of Ports	2
Timing Type	Synchronous
Max. Access Time (ns)	9@Flow-Through
Maximum Clock Rate (MHz)	200
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	770
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Packing Method	Tray
Original Package	FBGA
Pin Count	256
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1.25(Max)
Package Length	17
Package Width	17
PCB changed	256

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Products specifications

EU RoHS	Compliant
ECCN (US)	3A991.B.2.B
Part Status	Obsolete
Automotive	No
PPAP	No
Chip Density (bit)	18M
Number of Words	1M
Number of Bits/Word (bit)	18
Architecture	Flow-Through
Data Rate Architecture	SDR
Address Bus Width (bit)	20
Number of Ports	2
Timing Type	Synchronous
Max. Access Time (ns)	9@Flow-Through
Maximum Clock Rate (MHz)	200
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	770
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Packing Method	Tray
Original Package	FBGA
Pin Count	256
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1.25(Max)
Package Length	17
Package Width	17
PCB changed	256