CYD09S36V18-167BBXC

SKU: 122230

Manufacturer: Cypress - An Infineon Technologies Company

SRAM Chip Sync Dual 1.8V 9M-bit 256K x 36 11ns/6ns 256-Pin FBGA Tray

10 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991.B.2.B
Part Status	Obsolete
Automotive	No
PPAP	No
Chip Density (bit)	9M
Number of Words	256K
Number of Bits/Word (bit)	36
Architecture	Flow-Through
Data Rate Architecture	SDR
Address Bus Width (bit)	18
Number of Ports	2
Timing Type	Synchronous
Max. Access Time (ns)	11@Flow-Through
Maximum Clock Rate (MHz)	66.7@Flow-Through
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	570
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Packing Method	Tray
Original Package	FBGA
Pin Count	256
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1.25(Max)
Package Length	17
Package Width	17
PCB changed	256

Your name

Your email

Enquiry

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991.B.2.B
Part Status	Obsolete
Automotive	No
PPAP	No
Chip Density (bit)	9M
Number of Words	256K
Number of Bits/Word (bit)	36
Architecture	Flow-Through
Data Rate Architecture	SDR
Address Bus Width (bit)	18
Number of Ports	2
Timing Type	Synchronous
Max. Access Time (ns)	11@Flow-Through
Maximum Clock Rate (MHz)	66.7@Flow-Through
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	570
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Packing Method	Tray
Original Package	FBGA
Pin Count	256
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1.25(Max)
Package Length	17
Package Width	17
PCB changed	256