CY7C1512KV18-250BZXI

SKU: 138776

Manufacturer: Cypress - An Infineon Technologies Company

SRAM Chip Sync Dual 1.8V 72M-bit 4M x 18 0.45ns 165-Pin FBGA Tray

40 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991b.2.a.
Part Status	Active
HTS	8542.32.00.41
Automotive	No
PPAP	No
Chip Density (bit)	72M
Number of Words	4M
Number of Bits/Word (bit)	18
Architecture	Pipelined
Data Rate Architecture	QDR
Address Bus Width (bit)	42
Number of Ports	2
Timing Type	Synchronous
Max. Access Time (ns)	0.45
Maximum Clock Rate (MHz)	250
Process Technology	90nm, CMOS
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	650
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Packing Method	Tray
Original Package	FBGA
Pin Count	165
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.89
Package Length	15
Package Width	13
PCB changed	165

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Products specifications

EU RoHS	Compliant
ECCN (US)	3A991b.2.a.
Part Status	Active
HTS	8542.32.00.41
Automotive	No
PPAP	No
Chip Density (bit)	72M
Number of Words	4M
Number of Bits/Word (bit)	18
Architecture	Pipelined
Data Rate Architecture	QDR
Address Bus Width (bit)	42
Number of Ports	2
Timing Type	Synchronous
Max. Access Time (ns)	0.45
Maximum Clock Rate (MHz)	250
Process Technology	90nm, CMOS
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	650
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Packing Method	Tray
Original Package	FBGA
Pin Count	165
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.89
Package Length	15
Package Width	13
PCB changed	165