CY7C1474BV33-200BGXC

SKU: 150571

Manufacturer: Cypress - An Infineon Technologies Company

SRAM Chip Sync Octal 3.3V 72M-bit 1M x 72-bit 3ns 209-Pin FBGA Tray

60 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991.b.2.a
Part Status	Active
HTS	8542.32.00.41
Automotive	No
PPAP	No
Chip Density (bit)	72M
Number of Words	1M
Number of Bits/Word (bit)	72
Architecture	Pipelined
Data Rate Architecture	SDR
Address Bus Width (bit)	20
Number of Ports	8
Timing Type	Synchronous
Max. Access Time (ns)	3
Maximum Clock Rate (MHz)	200
Operating Supply Voltage-Min (V)	3.135
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.6
Operating Current (mA)	500
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Packing Method	Tray
Original Package	FBGA
Pin Count	209
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1.26
Package Length	22
Package Width	14
PCB changed	209

Your name

Your email

Enquiry

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991.b.2.a
Part Status	Active
HTS	8542.32.00.41
Automotive	No
PPAP	No
Chip Density (bit)	72M
Number of Words	1M
Number of Bits/Word (bit)	72
Architecture	Pipelined
Data Rate Architecture	SDR
Address Bus Width (bit)	20
Number of Ports	8
Timing Type	Synchronous
Max. Access Time (ns)	3
Maximum Clock Rate (MHz)	200
Operating Supply Voltage-Min (V)	3.135
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.6
Operating Current (mA)	500
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Packing Method	Tray
Original Package	FBGA
Pin Count	209
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1.26
Package Length	22
Package Width	14
PCB changed	209