CY7C1460AV25-167BZXI

SKU: 16122

Manufacturer: Cypress - An Infineon Technologies Company

SRAM Chip Sync Quad 2.5V 36M-bit 1M x 36 3.4ns 165-Pin FBGA Tray

70 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991
Part Status	Obsolete
HTS	8542.32.00.41
Automotive	No
PPAP	No
Chip Density (bit)	36M
Number of Words	1M
Number of Bits/Word (bit)	36
Architecture	Pipelined
Data Rate Architecture	SDR
Address Bus Width (bit)	20
Number of Ports	4
Timing Type	Synchronous
Max. Access Time (ns)	3.4
Maximum Clock Rate (MHz)	167
Process Technology	90nm, CMOS
Operating Supply Voltage-Min (V)	2.375
Typical Operating Supply Voltage (V)	2.5
Operating Supply Voltage-Max (V)	2.625
Operating Current (mA)	335
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Packing Method	Tray
Original Package	FBGA
Pin Count	165
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.89
Package Length	17
Package Width	15
PCB changed	165

Your name

Your email

Enquiry

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991
Part Status	Obsolete
HTS	8542.32.00.41
Automotive	No
PPAP	No
Chip Density (bit)	36M
Number of Words	1M
Number of Bits/Word (bit)	36
Architecture	Pipelined
Data Rate Architecture	SDR
Address Bus Width (bit)	20
Number of Ports	4
Timing Type	Synchronous
Max. Access Time (ns)	3.4
Maximum Clock Rate (MHz)	167
Process Technology	90nm, CMOS
Operating Supply Voltage-Min (V)	2.375
Typical Operating Supply Voltage (V)	2.5
Operating Supply Voltage-Max (V)	2.625
Operating Current (mA)	335
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Packing Method	Tray
Original Package	FBGA
Pin Count	165
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.89
Package Length	17
Package Width	15
PCB changed	165