CY7C1413AV18-250BZC

SKU: 89069

Manufacturer: Cypress - An Infineon Technologies Company

SRAM Chip Sync Dual 1.8V 36M-bit 2M x 18 0.45ns 165-Pin FBGA Tray

20 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Not Compliant
ECCN (US)	3A991.b.2.a
Part Status	Obsolete
HTS	8542.32.00.71
Automotive	No
PPAP	No
Chip Density (bit)	36M
Number of Words	2M
Number of Bits/Word (bit)	18
Architecture	Pipelined
Data Rate Architecture	QDR
Address Bus Width (bit)	19
Number of Ports	2
Timing Type	Synchronous
Max. Access Time (ns)	0.45
Maximum Clock Rate (MHz)	250
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	790
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Packing Method	Tray
Original Package	FBGA
Pin Count	165
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.89
Package Length	17
Package Width	15
PCB changed	165

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Products specifications

EU RoHS	Not Compliant
ECCN (US)	3A991.b.2.a
Part Status	Obsolete
HTS	8542.32.00.71
Automotive	No
PPAP	No
Chip Density (bit)	36M
Number of Words	2M
Number of Bits/Word (bit)	18
Architecture	Pipelined
Data Rate Architecture	QDR
Address Bus Width (bit)	19
Number of Ports	2
Timing Type	Synchronous
Max. Access Time (ns)	0.45
Maximum Clock Rate (MHz)	250
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	790
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Packing Method	Tray
Original Package	FBGA
Pin Count	165
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.89
Package Length	17
Package Width	15
PCB changed	165