CY7C1361C-100BZXE

SKU: 74972

Manufacturer: Cypress - An Infineon Technologies Company

SRAM Chip Sync Quad 3.3V 9M-bit 256K x 36 8.5ns Automotive 165-Pin FBGA Tray

1920 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991.B.2.B
Part Status	Active
HTS	8542.32.00.41
Automotive	Yes
PPAP	Unknown
Chip Density (bit)	9M
Number of Words	256K
Number of Bits/Word (bit)	36
Architecture	Flow-Through
Data Rate Architecture	SDR
Address Bus Width (bit)	18
Number of Ports	4
Timing Type	Synchronous
Max. Access Time (ns)	8.5
Maximum Clock Rate (MHz)	100
Process Technology	90nm, CMOS
Operating Supply Voltage-Min (V)	3.135
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.6
Operating Current (mA)	180
Operating Temperature-Min	-40
Operating Temperature-Max	125
Supplier Temperature Grade	Automotive
Packing Method	Tray
Original Package	FBGA
Pin Count	165
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.89
Package Length	15
Package Width	13
PCB changed	165

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Products specifications

EU RoHS	Compliant
ECCN (US)	3A991.B.2.B
Part Status	Active
HTS	8542.32.00.41
Automotive	Yes
PPAP	Unknown
Chip Density (bit)	9M
Number of Words	256K
Number of Bits/Word (bit)	36
Architecture	Flow-Through
Data Rate Architecture	SDR
Address Bus Width (bit)	18
Number of Ports	4
Timing Type	Synchronous
Max. Access Time (ns)	8.5
Maximum Clock Rate (MHz)	100
Process Technology	90nm, CMOS
Operating Supply Voltage-Min (V)	3.135
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.6
Operating Current (mA)	180
Operating Temperature-Min	-40
Operating Temperature-Max	125
Supplier Temperature Grade	Automotive
Packing Method	Tray
Original Package	FBGA
Pin Count	165
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.89
Package Length	15
Package Width	13
PCB changed	165