CY7C1360C-200BGC

SKU: 60994

Manufacturer: Cypress - An Infineon Technologies Company

SRAM Chip Sync Quad 3.3V 9M-bit 256K x 36 3ns 119-Pin BGA Tray

390 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Not Compliant
ECCN (US)	3A991b.2.a.
Part Status	Active
HTS	8542.32.00.41
Automotive	No
PPAP	No
Chip Density (bit)	9M
Number of Words	256K
Number of Bits/Word (bit)	36
Architecture	Pipelined
Data Rate Architecture	SDR
Address Bus Width (bit)	18
Number of Ports	4
Timing Type	Synchronous
Max. Access Time (ns)	3
Maximum Clock Rate (MHz)	200
Process Technology	CMOS
Operating Supply Voltage-Min (V)	3.135
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.6
Operating Current (mA)	220
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Packing Method	Tray
Original Package	BGA
Pin Count	119
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1.46
Package Length	22
Package Width	14
PCB changed	119

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Products specifications

EU RoHS	Not Compliant
ECCN (US)	3A991b.2.a.
Part Status	Active
HTS	8542.32.00.41
Automotive	No
PPAP	No
Chip Density (bit)	9M
Number of Words	256K
Number of Bits/Word (bit)	36
Architecture	Pipelined
Data Rate Architecture	SDR
Address Bus Width (bit)	18
Number of Ports	4
Timing Type	Synchronous
Max. Access Time (ns)	3
Maximum Clock Rate (MHz)	200
Process Technology	CMOS
Operating Supply Voltage-Min (V)	3.135
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.6
Operating Current (mA)	220
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Packing Method	Tray
Original Package	BGA
Pin Count	119
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1.46
Package Length	22
Package Width	14
PCB changed	119