CY7C1314KV18-250BZC

SKU: 51602

Manufacturer: Cypress - An Infineon Technologies Company

SRAM Chip Sync Dual 1.8V 18M-bit 512K x 36 0.45ns 165-Pin FBGA Tray

460 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Not Compliant
ECCN (US)	3A991.b.2.a
Part Status	Active
HTS	8542.32.00.41
Automotive	No
PPAP	No
Chip Density (bit)	18M
Number of Words	512K
Number of Bits/Word (bit)	36
Architecture	Pipelined
Data Rate Architecture	QDR
Address Bus Width (bit)	36
Number of Ports	2
Timing Type	Synchronous
Max. Access Time (ns)	0.45
Maximum Clock Rate (MHz)	250
Process Technology	CMOS
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	670
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Packing Method	Tray
Pin Count	165
Standard Package Method	BGA
Original Package	FBGA
Terminal Form	Surface Mount
Package Height	0.89
Package Length	15
Package Width	13
PCB changed	165

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Products specifications

EU RoHS	Not Compliant
ECCN (US)	3A991.b.2.a
Part Status	Active
HTS	8542.32.00.41
Automotive	No
PPAP	No
Chip Density (bit)	18M
Number of Words	512K
Number of Bits/Word (bit)	36
Architecture	Pipelined
Data Rate Architecture	QDR
Address Bus Width (bit)	36
Number of Ports	2
Timing Type	Synchronous
Max. Access Time (ns)	0.45
Maximum Clock Rate (MHz)	250
Process Technology	CMOS
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	670
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Packing Method	Tray
Pin Count	165
Standard Package Method	BGA
Original Package	FBGA
Terminal Form	Surface Mount
Package Height	0.89
Package Length	15
Package Width	13
PCB changed	165