EU RoHS
|
Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
Active |
HTS
|
8542.33.00.01 |
Automotive
|
No |
PPAP
|
No |
Type
|
High Speed Amplifier |
Manufacturer Type
|
High Speed Amplifier |
Number of Channels per Chip
|
4 |
Maximum Input Offset Voltage (mV)
|
0.5@±5V |
Minimum Dual Supply Voltage (V)
|
±4.5 |
Typical Dual Supply Voltage (V)
|
±5 |
Maximum Dual Supply Voltage (V)
|
±18 |
Maximum Input Offset Current (uA)
|
0.1@±5V |
Typical Input Bias Current (uA)
|
0.125@±5V |
Maximum Input Bias Current (uA)
|
0.6@±5V |
Maximum Supply Current (mA)
|
10@±5V |
Power Supply Type
|
Dual |
Typical Slew Rate (V/us)
|
90@±5V |
Typical Input Noise Voltage Density (nV/rtHz)
|
7@±5V |
Input Offset Voltage Drift (uV/°C)
|
3.5(Typ) |
Typical Voltage Gain (dB)
|
83 |
Typical Noninverting Input Current Noise Density (pA/rtHz)
|
0.8@±5V |
Minimum PSRR (dB)
|
92 |
Minimum CMRR (dB)
|
76 |
Minimum CMRR Range (dB)
|
75 to 80 |
Typical Gain Bandwidth Product (MHz)
|
22 |
Typical Settling Time (ns)
|
280 |
Shut Down Support
|
No |
Operating Temperature-Min
|
-40 |
Operating Temperature-Max
|
85 |
Supplier Temperature Grade
|
Extended Industrial |
Packing Method
|
Tape and Reel |
Pin Count
|
16 |
Standard Package Method
|
SOP |
Original Package
|
SOIC W |
Terminal Form
|
Surface Mount |
Package Height
|
2.35(Max) |
Package Length
|
10.5(Max) |
Package Width
|
7.6(Max) |
PCB changed
|
16 |