EU RoHS
|
Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
Active |
HTS
|
8542.39.00.01 |
Automotive
|
Yes |
PPAP
|
Unknown |
Type
|
General Purpose |
Number of Channels per Chip
|
3 |
Maximum Data Rate
|
1Mbps(Min) |
Maximum Rise Time (ns)
|
2.5(Typ) |
Maximum Fall Time (ns)
|
2.5(Typ) |
Minimum Pulse Width (ns)
|
1000(Max) |
Maximum Pulse Width Distortion (ns)
|
40 |
Maximum Propagation Delay Skew (ns)
|
50 |
Output Type
|
CMOS |
Operating Supply Voltage-Max (V)
|
5.5 |
Operating Supply Voltage-Min (V)
|
4.5 |
Maximum Propagation Delay Time (tPHL) (ns)
|
100 |
Minimum Isolation Voltage (Vrms)
|
2500 |
Maximum Propagation Delay Time (tPLH) (ns)
|
100 |
Maximum Working Insulation Voltage
|
560Vp |
Maximum Quiescent Supply Current (mA)
|
2.5/1 |
Operating Temperature-Min
|
-40 |
Operating Temperature-Max
|
125 |
Packing Method
|
Tube |
Typical Operating Supply Voltage (V)
|
5 |
Forward/Reverse Channels
|
3/0 |
Minimum Common Mode Rejection (kV/us)
|
25 |
Coupling Type
|
Magnetic Coupling |
Standard Package Method
|
SOP |
Original Package
|
SOIC W |
Pin Count
|
16 |
Terminal Form
|
Surface Mount |
Package Height
|
2.35(Max) |
Package Length
|
10.5(Max) |
Package Width
|
7.6(Max) |
PCB changed
|
16 |