EU RoHS
|
Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
Active |
HTS
|
8542.33.00.01 |
Automotive
|
No |
PPAP
|
No |
Type
|
High Speed Amplifier |
Manufacturer Type
|
High Speed Amplifier |
Number of Channels per Chip
|
3 |
Process Technology
|
XFCB |
Maximum Input Offset Voltage (mV)
|
11@5V |
Minimum Single Supply Voltage (V)
|
4.5 |
Typical Single Supply Voltage (V)
|
5 |
Maximum Single Supply Voltage (V)
|
10 |
Minimum Dual Supply Voltage (V)
|
±2.25 |
Typical Dual Supply Voltage (V)
|
±3 |
Maximum Dual Supply Voltage (V)
|
±5 |
Typical Input Bias Current (uA)
|
7.7@5V |
Maximum Input Bias Current (uA)
|
21(Min)@5V |
Maximum Quiescent Current (mA)
|
28.2@5V |
Typical Output Current (mA)
|
70@5V |
Power Supply Type
|
Single |
Typical Slew Rate (V/us)
|
2860@5V |
Typical Input Noise Voltage Density (nV/rtHz)
|
1.8@5V |
Input Offset Voltage Drift (uV/°C)
|
14.2@5V |
Typical Inverting Input Current Noise Density (pA/rtHz)
|
36@5V |
Typical Noninverting Input Current Noise Density (pA/rtHz)
|
3@5V |
Minimum PSRR (dB)
|
50 |
Minimum CMRR (dB)
|
45 |
Minimum CMRR Range (dB)
|
<50 |
Typical Settling Time (ns)
|
12 |
Shut Down Support
|
No |
Operating Temperature-Min
|
-40 |
Operating Temperature-Max
|
85 |
Supplier Temperature Grade
|
Industrial |
Packing Method
|
Tape and Reel |
Pin Count
|
24 |
Standard Package Method
|
CSP |
Original Package
|
LFCSP EP |
Terminal Form
|
Surface Mount |
Package Height
|
0.73 |
Package Length
|
4 |
Package Width
|
4 |
PCB changed
|
24 |