EU RoHS
|
Not Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
Active |
HTS
|
8542.33.00.01 |
SVHC
|
Yes |
SVHC Exceeds Threshold
|
Yes |
Automotive
|
No |
PPAP
|
No |
Type
|
High Speed Amplifier |
Manufacturer Type
|
High Speed Amplifier |
Number of Channels per Chip
|
1 |
Rail to Rail
|
Rail to Rail Output |
Process Technology
|
BiCOM |
Maximum Input Offset Voltage (mV)
|
7@5V |
Minimum Single Supply Voltage (V)
|
3 |
Typical Single Supply Voltage (V)
|
9 |
Maximum Single Supply Voltage (V)
|
12 |
Minimum Dual Supply Voltage (V)
|
±1.5 |
Typical Dual Supply Voltage (V)
|
±3 |
Maximum Dual Supply Voltage (V)
|
±6 |
Maximum Input Offset Current (uA)
|
0.5@5V |
Maximum Input Bias Current (uA)
|
3.2@5V |
Power Supply Type
|
Dual |
Typical Slew Rate (V/us)
|
160@5V |
Typical Input Noise Voltage Density (nV/rtHz)
|
16@5V |
Typical Voltage Gain (dB)
|
95 |
Typical Noninverting Input Current Noise Density (pA/rtHz)
|
0.6@5V |
Minimum PSRR (dB)
|
72 |
Minimum CMRR (dB)
|
74 |
Minimum CMRR Range (dB)
|
71 to 75 |
Typical Settling Time (ns)
|
55 |
Shut Down Support
|
No |
Operating Temperature-Min
|
-55 |
Operating Temperature-Max
|
125 |
Supplier Temperature Grade
|
Military |
Packing Method
|
Tube |
Original Package
|
CDIP |
Pin Count
|
8 |
Standard Package Method
|
DIP |
Terminal Form
|
Through Hole |
Package Height
|
3.56(Max) |
Package Length
|
10.29(Max) |
Package Width
|
7.87(Max) |
PCB changed
|
8 |